According to reports from Korea, NVIDIA is considering Samsung as a potential partner for both HBM3 memory and 2.5D chip packaging. This is because TSMC, NVIDIA's current partner, has limited capacity to handle all of its customers' advanced chip packaging needs. However, Samsung is not the only potential partner NVIDIA is looking at. SPIL, based in Taiwan, and Amkor Technology, based in the US, are also being considered for the 2.5D chip packaging.
When it comes to HBM3 memory, NVIDIA doesn't have many options. SK Hynix is currently its partner, and NVIDIA will continue to work with them for HBM memory in its high-end AI accelerators and GPUs. Samsung is likely trying to win NVIDIA back as a foundry customer by showing that it can handle chip packaging for NVIDIA. Samsung will use its I-Cube 2.5D packaging technology, and it is suggested that Samsung will still use TSMC-made GPU wafers paired with Samsung HBM3 memory. Samsung has not yet started mass production of HBM3 memory, but it has provided evaluation samples to customers, which have received positive feedback. Nothing has been agreed upon yet, and TSMC is looking to expand its 2.5D packaging business by over 40 percent. The question is how quickly TSMC can move before its customers start considering other competitors.
