SK hynix Partners with Intel to Advance HBM Memory Packaging Using EMIB Technology
SK hynix is joining forces with Intel to leverage Intel’s Embedded Multi-die Interconnect Bridge (EMIB) 2.5D packaging technology for its High Bandwidth Memory (HBM) products. As the demand for advanced AI hardware grows and customers increasingly consider Intel Foundry for their manufacturing needs, SK hynix is actively exploring research and development opportunities with Intel to integrate EMIB into its next-generation HBM solutions.
Understanding EMIB: Intel’s Advanced 2.5D Packaging Solution
Intel’s EMIB technology stands out as a leading 2.5D packaging solution, enabling the interconnection of multiple silicon dies through bridges embedded within the packaging substrate. This approach allows for high-density, low-cost connections between logic and memory components, making it particularly well-suited for logic-to-logic and logic-to-HBM interfaces. EMIB is available in several variants, such as EMIB-M, which incorporates embedded MIM capacitors, and EMIB-T, which features through-silicon vias (TSVs) for enhanced connectivity.
Transitioning from TSMC CoWoS to Intel EMIB
Historically, SK hynix has relied on TSMC’s CoWoS (Chip-on-Wafer-on-Substrate) 2.5D packaging technology for its HBM products. However, as CoWoS approaches its scaling limits and customers seek alternative packaging methods, Intel’s EMIB is emerging as a compelling option. EMIB enables chiplet integration beyond the traditional reticle limit of 830 mm², supporting the continued evolution of advanced semiconductor designs.
While SK hynix manufactures its own silicon, the company does not currently offer advanced packaging solutions in-house. Its most sophisticated packaging technique to date is hybrid bonding, which stacks silicon dies and connects them using thousands of TSVs. For large-scale AI accelerators, which require the integration of multiple HBM packages into a single unified module, advanced packaging technologies like TSMC’s CoWoS and now Intel’s EMIB are essential.
Looking Ahead: R&D and Future HBM Integration
SK hynix’s collaboration with Intel is focused on ensuring that its upcoming HBM4 memory modules are compatible with EMIB, positioning the company to meet the needs of AI chip partners who may select Intel Foundry for advanced packaging. While there is no official timeline for the commercial availability of EMIB-enabled HBM products, ongoing research and development efforts signal that progress is underway. The industry anticipates seeing the first results of this partnership in the near future as both companies work to push the boundaries of high-performance memory and packaging technologies.
